via hole
英 [ˈvaɪə həʊl]
美 [ˈvaɪə hoʊl]
网络 导通孔; 通孔; 導通孔; 贯穿孔; 过孔
双语例句
- General Radiation via Tunneling in a Charged BTZ Black Hole
带电BTZ黑洞一般性辐射的隧穿效应 - The limitation of the theoretical formula was analyzed for calculating the inductance of column via hole.
分析了理论公式在计算截圆锥通孔电感中的局限性。 - The air-in via hole is provided with a lifting post which can seal the air-in via hole;
该进气通孔上设有可封住该进气通孔的升降柱； - The utility discloses a tape tearing bayonet which is clamped on the edge of tape while tape can be drawn out when in use easily to be cut via a rolling hole.
本实用新型公开一种胶带撕断卡口，卡在胶带外缘上，使用时可随时拽出胶带，并能轧孔切断。 - The piston disc includes: the disc plate which is equipped with the via hole forming the fluid channel;
该活塞盘包括：盘体，其具有用于形成该流体通道的通孔； - The utility model relates to a hand-operated forced air-tight type air tap of gas-filled products, comprising an air tap seat with an air-in via hole arranged at the middle.
一种充气产品的手动强制气密式气嘴，包括其中部设有进气通孔的气嘴座； - I've already contacted our HQ via handy phone, they told me that the ghost are spending the new year vacation, have Carnival in the hole, no time to look around!
我已经给总部打过手机了，他们说这两天妖怪在过年，正在洞里狂欢呢。还没时间出来晃！ - Could you tell me the price different between micro via PCB and through hole via PCB?
你能告诉我微过孔电路板与穿透式过孔电路板价钱的差别吗？ - The matellization process of blind via or though hole is also achieved by means of copper electroplating.
盲孔或通孔的属化制程也是直接用电镀的方式完成。 - Via ports scanning, it can gained many useful information, also find out system security hole.
通过端口扫描，可以得到许多有用的信息，从而发觉系统的安全漏洞。 - The free energy and entropy of spin fields are calculated via brick-wall model in Gibbons-Maeda black hole background.
用brick-wall模型研究了Gibbons-Maeda黑洞背景下自旋场的量子熵。 - The shape of wetting soil, the wetting front movement law, the soil moisture content and redistribution law under the film hole multi point sources interference infiltration are studied via a great number of the tests of film hole multi point sources interference infiltration.
通过大量膜孔多点源交汇入渗试验，研究了膜孔多点源交汇入渗湿润体形状、湿润锋运移规律、湿润体内土壤含水量和土壤水分的再分布规律。 - This paper selects a type of injecting device for direct contact thermal storage system via experiments. Some experimental study on effect of injecting hole number, diameter was conducted.
本文通过试验选择适合于直接接触式蓄冷装置的喷射装置的型式，并对喷孔数、喷孔直径对直接接触式换热的影响进行了试验研究。 - Moreover, if we consider the tunneling process as a reversible process, the result in Hawking radiation via tunneling is consistent with the first and second law of black hole thermodynamics.
而且，如果认为量子隧穿过程为可逆过程，则量子隧穿效应中的结果与黑洞热力学第一、第二定律是一致的。 - The methods of solving 'double upburst'are beforehand deflation via the hole in layers, beforehand deflation via the hole in the same direction as layers and affusion in layers.
解突技术方法有穿层孔预抽放、顺层孔预抽放和煤层注水。 - Joint Interpretation of Reflectors via Well Logging and Seismic Data in the Pilot Hole of CCSD
测井和地震联合解释CCSD先导孔反射体 - Clinical study of early treating cerebroventricular haemorrhage with microsurgery via key hole in triangular area of lateral cerebral ventricle
早期经侧脑室三角区锁孔入路治疗脑室内出血的临床研究 - An efficient method to calculate the quasi-static capacitance of the via hole structure embedded in a multilayered dielectric media named Dimension Reduction Technique ( DRT) is presented.
本文采用维数缩减技术（DRT）提取了多层介质中通孔结构的准静态电容参数。 - The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account.
分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。 - Results Intaking food and rCBF were decreased and neurological disorders were observed. Conclusions An experimental rabbit model of symp-tomatic cerebral vasospasm can be established by injecting blood via a cranial hole after bilateral common carotid arteries, ligation.
结果SAH后动物进食量下降，神经功能出现障碍，rCBF下降、结论兔颈总动脉结扎、顶骨钻孔2次注血可以制成结果可靠而操作简便的症状性脑血管痉挛模型。 - Three-dimension finite element modeling has been used to simulate and compare the current density, temperature and the gradients of distribution in Copper-filled via hole structure.
利用三维有限元模型对Cu互连线通孔进行了电流密度、温度和温度梯度的分布进行了模拟，比较了具有不同阻挡层材料的通孔内的电流密度、温度和温度梯度的分布。 - To the same barrier material, the via hole with different slope has been simulated.
对于同一阻挡层材料，进行了不同通孔倾斜角的模拟。 - A study on GaAs backside via hole etching technique
GaAs背面通孔刻蚀技术研究 - It was found that due to the high aspect ratio of holes for the high density application, weak plating quality and copper corrosion attribute to the via hole crack, resulting in a high field return rate.
由于高密度的封装，电镀质量的薄弱和铜腐蚀导致了通孔开裂，使返厂维修率很高。 - Besides, this paper presents a new type of microwave photonic crystal structure ( AUC-EBG) and the AUC-EBG structure with metal via hole.
同时，本文提出的新型微波光子晶体结构（AUC-EBG）和带金属过孔的AUC-EBG结构，使得结构更加紧凑，性能更加优越。 - The second packaging project adopts the quartz as the substrate, via hole drilled by sandblasting is used for the RF signal extraction.
第二种封装设计是采用石英作为封装的衬底，并且石英衬底通过喷砂技术打出通孔，引出RF信号端。 - The contact via hole etch is one of the key processes in IC manufacturing.
自对准接触通孔刻蚀工艺是大规模集成电路制造流程中最关键的工艺之一。 - The cases selected by the teachers must show the chrisma of solving mathematics problems via algorithms, reflect the core concept of algorithms, expressing the valuable idea that algorithms must be taught throughout the hole way of high-school mathematics instruction.
教师所选的案例，应该展示出算法程序框图解决数学问题的魅力，体现出算法的核心思想，说明算法教学贯穿高中数学新课程的价值。 - Therefore, crack initiates at the weak plating locations or corroded points and then propagates across the whole via hole.
因此，开裂从最薄弱的位置开始延伸到整个通孔。 - With the application of silicon high aspect ratio micro-structure on MEMS technology and through-silicon via hole on 3-D packages technology, inductively coupled plasma ( ICP) etching technique for silicon has become a hot research topic in civil and overseas.
随着MEMS技术中硅基高深宽比微细结构和3-D封装中穿透硅通孔技术的应用，硅的感应耦合等离子体（ICP）刻蚀技术成为国内外研究的热点。